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1) Extremly strong interface bonding which can repeatedly resist 850°C heat shock 2) Tailorable CTE matching that of semiconductor and ceramic materials 3) High thermal conductivity 4) No magnetism. It is widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate
link:https://www.ygmetal.com/clad-metals/clad-metal-for-coinage/cumocu-for-electronic-package-and-heat-sink.html
CuMoCu For Electronic Package And Heat Sink